36Kr Exclusive: With Exclusive Investment of Tens of Millions from创维, This Company Reduces Silicon Carbide Cutting Loss to Under 40 Micrometers 36氪首发 | 创维独家投资数千万，这家企业将碳化硅切割损耗降至40微米内

The silicon carbide (SiC) industry has recently been stirred up by a new company. Zhongwei Jingyi, an enterprise founded only last November, has secured an angel+ round of tens of millions of yuan, with an exclusive bet placed by Skyworth Investment. Their claimed goal is to reduce the laser slicing loss of SiC crystal ingots from the industry-common 80–120 micrometers to under 40 micrometers.

What does this number mean? As 8-inch SiC production lines are about to ramp up, slicing loss is the critical factor that determines whether costs can truly be reduced. According to their claim, halving the loss means one additional qualified wafer for every eight sliced. For SiC substrate manufacturers currently operating at a loss, this sounds like a lifeline. Founder Chen Jingyu even stated bluntly, "Right now, it’s not us seeking customers—it’s customers urging us to enter the market." Amid the polished rhetoric, there’s an underlying urgency.

However, stepping back to think calmly, the core bet of this company’s story lies entirely in the scalability of its "technology platform." From SiC slicing to diamond processing, and extending to quantum chip device fabrication, the scope spans so widely it’s almost dizzying. Is their technological capability truly that versatile, or does the capital narrative simply require a more appealing "platform" storyline? Thoroughly studying the underlying mechanisms of laser-material interaction is undoubtedly valuable, but industrial applications have never been fully covered by laboratory research papers. From validation to mass production, from switching one material to another, every step—process parameters, yield control, customer adaptation—leads into deep waters.

In particular, the timeline of "initiating delivery of quantum chip processing devices to customers in July or August this year" sounds more like a schedule set to demonstrate "platform scalability." The field of quantum computing is still in its very early stages; whether core component processing demands are substantial enough to support an entire business line raises a huge question mark. Wouldn’t a more common development path be to first thoroughly penetrate and secure a firm footing in the clear and vast SiC market? Such an aggressive move risks overextending resources.

A deeper industry context is that laser slicing equipment, a critical segment, has long been monopolized by foreign companies, posing a "chokepoint" risk. Zhongwei Jingyi claims to possess fully independent and controllable capabilities from optical path control to system design—this is certainly worth anticipating. However, self-sufficiency and commercial success are two different things. Outperforming laboratory data in technical parameters doesn’t guarantee handling the ever-changing actual conditions on a customer’s production line. The founder’s mention that the equipment "can run mass production on the day it’s installed" is laden with marketing flair; real-world industrial equipment integration is rarely so effortless or romantic.

Skyworth Investment’s exclusive bet, with its investment portfolio covering substrates, epitaxy, and devices, appears more like an industrial capital strategy—attempting to embed a potential cost-reducing equipment link within its own invested supply chain. This is a resource synergy approach, but whether that synergy materializes depends on whether Zhongwei Jingyi’s products can truly be reliable, efficient, and cost-competitive as promised. If the equipment’s performance falls short or remains unstable, even with "internal recommendations," it will struggle to stay long-term on the demanding production lines of leading clients.

In summary, Zhongwei Jingyi’s narrative is compelling: seizing the window of SiC industry upgrade with a disruptive low-loss technology, and painting a blueprint of a technology platform spanning third-generation semiconductors to quantum computing. However, this company is only half a year old, its products are still in the validation phase with leading clients, and all optimistic visions remain on slides and in interviews. The next six months to a year will reveal the truth: will its equipment truly become the "decisive factor" on customer production lines as advertised, or will it become another tech upstart that raised funds on concepts amid an industry boom only to sink into a prolonged validation quagmire? The market will give the most authentic evaluation.

碳化硅行业最近又被一家新公司搅动了水花。中微精仪，一家去年11月才成立的企业，已经拿到了数千万元的天使+轮融资，而且是创维投资独家下注。他们声称要做的事，是把碳化硅晶锭的激光剥离损耗，从行业常见的80-120微米，直接砍到40微米以内。

这个数字意味着什么？在8英寸碳化硅产线即将上马的关键时刻，切割损耗是决定成本能否真正降下来的命门。按照他们的说法，损耗减半，相当于每切8片就能多出1片合格品。对于目前“卖一片亏一片”的碳化硅衬底厂商来说，这听起来简直是救命稻草。创始人陈景煜甚至直言“现在不是我们找客户，是客户在催我们进场”，场面话里透着一股急切。

但冷静想想，这家公司的故事，核心赌注全压在“技术平台”的可扩展性上。从碳化硅切割，到金刚石加工，再延伸到量子芯片器件加工，跨度大得让人有点恍惚。是技术能力真的如此通透，还是资本故事需要一个更性感的“平台”叙事？把激光和材料相互作用的底层机理研究透，当然很有价值，但工业级应用从来不是实验室里的论文能覆盖的。从验证到量产，从一个材料切换到另一个材料，工艺参数、良率控制、客户适配，每一步都是深水区。

尤其“今年七至八月份启动量子芯片加工器件客户交付”这个节点，听起来更像是一个为了证明“平台可扩展性”而设定的时间表。量子计算领域当前还处于极早期，核心元器件加工需求是否成规模、能否支撑一条业务线，要打一个巨大的问号。更常见的发展路径，难道不是先把碳化硅这个明确且庞大的市场吃透、站稳吗？步子迈得这么大，小心扯着蛋。

更深层的行业背景是，激光切割设备这个关键环节，长期被国外企业垄断，存在“卡脖子”风险。中微精仪声称具备从光路调控到系统设计的全链条自主可控能力，这当然是值得期待的。但自主可控和商业成功是两回事。技术参数跑赢了实验室数据，不代表能搞定客户生产线上千变万化的实际工况。创始人提到设备“进场当天就能跑量产”，这种表述充满了营销色彩，真实的工业设备导入，哪有如此轻松浪漫？

创维投资独家押注，并提到其投资组合覆盖了衬底、外延、器件等环节。这更像是一个产业资本的布局，试图在自家投资的产业链条内部，嵌入一个可能降低整体成本的装备环节。这是一种资源协同的打法，但协同效应能否兑现，取决于中微精仪的产品是否真能如承诺般可靠、高效且具备成本优势。如果设备性能不达标或不稳定，即便有“内部推荐”，也难以在挑剔的头部客户产线上长期留存。

总而言之，中微精仪的故事讲得很动听：抓住碳化硅升级的窗口期，用颠覆性的低损耗技术切入，并描绘了一个从第三代半导体到量子计算的技术平台蓝图。但这家公司成立才半年多，产品尚在头部客户验证阶段，所有美好愿景都还停留在PPT和访谈里。接下来的半年到一年，将是真相揭晓的时刻：是其设备真的如宣传所说，能成为客户产线上“决定胜负的关键”，还是又一个在产业热潮中靠概念融资、随后陷入漫长验证泥潭的科技新贵？市场会给出最真实的评分。